Flip Chip Bonder at flip-chip-bonder.net

With a large flip chip installed base, Datacon - the flip chip pioneer from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes.

The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for its take-off into high volume.

With mass-produced products, such as in consumer products, the trend is steadily moving away from wire-bonded components toward compact, advanced flip chip packages.