Die Bonder at die-bonder.net

MCM Die Bonder Technical jargon divides the semiconductor industry into two main areas: the öfront-endô and the öback-end.ô Front-end refers to all processes aimed at producing the chips themselves. Back-end designates the final processes for the production of integrated chips: testing, splitting of semiconductor disk (wafer) into chips, chip assembly, electronic contact and encapsulation.
The 2200 apm Multi Chip Die Bonder is the current industry standard based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform, a revolutionary modular system introduced in 1995.The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market.